Aluminum Zipper Fin Heat Sink
Zipper fins heat sinks are stamped from thin metal sheet, usually aluminum or copper, and are formed into custom shapes. The sheets are designed to interlock with a very narrow space between their layers. The fin thickness is determined by the thickness of the fin used. The fin assembly is wave soldered to a metal base forming a very rigid, lightweight heat sink. When the fin stack has enough fins for the application of the stack, it will be removed from the punching area and then wave soldered/bonded to a metal base to form a zipper fin heat sink.
- Product Introduction
Products Description
Our precision skived zipper fin heat sinks redefine thermal management through advanced manufacturing technology. By precision-slicing aluminum billets into ultra-thin fins (0.3-0.8mm) with interlocking teeth, we create monolithic structures with 18-45 fins/inch density – delivering 40% more surface area than extruded solutions in identical footprints. Engineered for high-flux thermal management in confined spaces, these solutions provide direct-attach cooling for:
High-power COB LEDs
IGBT/SiC power modules
RF amplifiers
Medical lasers
Product Specification
|
Brand Name |
ZP |
|
Process |
Reflow soldering, stamping |
|
Material |
Copper base+ Aluminum zipper |
|
Shape |
Square |
|
Application |
1U server Intel CPU, IPC box, Computer |
|
Finish |
Passivating, Nickel plating |
|
Extra process |
CNC Machining |
|
Fin thickness |
0.25 mm |
|
Fin Pitch |
1.36 mm |
|
Cooling type |
passive |
Product Features
Breakthrough Surface Density: 45 fins/inch configuration enables extreme heat dissipation in minimal volumes - ideal for compact high-power designs
Zero Interface Resistance: Monolithic construction eliminates thermal joints between base and fins
Directional Airflow Optimization: Angled fin stacks create natural chimney effect for 30% better convection
Vibration Immunity: Interlocked fin design withstands 15G shock (MIL-STD-202G)
Precision Component Interface: CNC-machined base achieves Ra<0.4μm for optimal TIM performance
Thermal Uniformity: Maintains <5°C gradient across 300mm arrays
Weight Efficiency: Aluminum versions deliver copper-like performance at 60% weight reduction
Product Application
Mission-critical cooling for:
High-Power LED Systems: Stadium lights, grow lights, UV curing
Power Electronics: EV chargers, solar inverters, motor drives
Telecom Infrastructure: 5G mMIMO units, baseband processors
Defense Systems: Radar cooling, directed energy weapons
Medical Equipment: Imaging systems, surgical lasers
Custom zipper fin solutions for aerospace avionics
High-performance computing cooling
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