Server
The rapid development of Internet, also brought the prosperity of the server market, a large amount of data storage, computing server would have to be done. A large-scale web site needs a huge number of servers, prevent because traffic cause server crash. We also often see, rows of huge rooms of servers, these servers are mostly enterprise server.
Enterprise server belong to high-end servers, enterprise server is used at least more than four symmetrical CPU processor structure, some as high as dozens of. These servers, mostly need to run 24 hours a day. So the caZPfic value, usually can use air conditioning to reduce indoor temperature, or change the interior layout, reasonable heat dissipation. The corresponding strategy, once appear, overtemperature phenomenon will shut down the system, transfer tasks. From a long-term perspective, the breakthrough of heat dissipation technology can effectively help the management of the heat.
Because of the heat pipe heatsink and cooling(fan+heat sink) can better solve the problem of the high power heatsink, and liquid cooling plate can solve most of the hot issues, especially on lower indoor temperature, through the air convection doesn't work. Water-cooled heat dissipation can control the heat source chip at a stable temperature, and running noise will reduce the number of times. At the same time in the rapid development of Internet, the corresponding hidden danger also need to guard against in a timely manner. In recent years on the international big companies are embarking on server solution, for the question of the server cooling,users can consult us.
After tried a variety of cooling ways, multiple data show that the most obvious. The advantage of water cooling heat dissipation efficiency is high, quiet and stable, can ensure the server run efficiently. But large enterprise server, need complete sets of water cooling scheme, for the design of the whole test and product have higher requirements, and ZP technology has done a lot of successful server cooling case, for suffering from heat users can consult our server.
I believe that with the passage of time, liquid cooled server will be more and more applied to the heat dissipation of the server, for each enterprise to solve the practical difficulties.
Industrial Switch
In today's rapid industrial development, heat dissipation has become particularly important, and excessive temperature has a fatal impact on industrial-grade switches. Therefore, when designing such products, the engineering team of ZP should not only understand how to select industrial-grade components with a wide temperature range, but also pay more attention to the thermal design of equipment.
Generally speaking, heat dissipation systems of switches are divided into two types: front inlet, rear outlet, left inlet and right outlet. There is no good or bad difference between these two types of heat dissipation systems.
ZP technology adopts the combined design of thermal PAD, CPU heat sink with fan, with fast heat dissipation speed and stable heat dissipation effect in long-term use.Thermal conductive silicon sheet is mainly used in the main board and the shell, the thermal conductivity of thermal between selection of thermal conductivity of silicon sheet the main purpose is to reduce the heat cooling device and the surface contact between the contact thermal resistance, thermal conductivity silicone can good filling contact clearance, with the supplement of the thermal conductive silicone piece can improve the contact area between the heat source and heat sink full contact, truly face-to-face contact, on the temperature of the reaction can reach as far as possible small temperature difference, thermal conductive silicone piece not only has the insulation performance, and shock absorption sound-absorbing effect.
The heat dissipation system of industrial switches requires scientific and reasonable layout of thermal PAD, heat sink, fans, CUP and other components to ensure good heat dissipation and improve the stability of switches.
Wireless base station
In the context of increasingly fierce market competition, as a relatively mature wireless base station product, its reliability requirements are increasingly high, especially for heat dissipation and noise put forward more stringent requirements, so ZP thermal solution team for wireless base station heat dissipation and noise improvement.
First of all, through the basic component unit of the wireless base station cooling path analysis, put forward a series of improvement measures, including the power amplifier unit heat heat sink optimization to improve the test method improvement, baseband board, thermoelectric refrigeration technology is applied to the battery cabinet cooling improvement, power supply, heat dissipation, noise improvement. Is to use the active or passive cooling heat dissipation, is the use of heat pipe heat sink or liquid cooling plate, in order to in a short time, analysis the feasibility and effect of improvement measures, the use of thermal simulation tools as the main means, respectively of the baseband board, battery cabinet, power board, modeling and simulation analysis to optimize the results of simulation analysis at the same time,The reliability accelerated life test method is used to verify the feasibility of the simulation results.
Secondly, based on the relation and distinction between heat and noise theory analysis, and then to improve the noise of wireless base stations, find the balance point of wireless base stations heat and noise, ZP with customers, through the method of speed control strategy on the premise of a small amount of increase or decrease costs, boost the reliability of wireless base stations.
Change going mobile network technology in the world, GSM, WCDMA and LTE with amazing transmission rate to meet the demand of the user's data, in which high frequency materials and heatsink has played a key role. As the rebound, antenna, power amplifier, microwave, small base station is an important part of a create mobile communication network, such as low loss dielectric material is also the foundation of the technology. In the future, high frequency materials and thermal technology also will be the next generation mobile network, which will reach millimeter wave band 5G key technology.
