Skiving Fin Copper Heat Sink
High precision skiving fin copper heat sink, with its fine heat dissipation performance, is widely used in industrial fields such as power supply, rail transit, aviation, telecommunication etc.
- Product Introduction
Achieve unprecedented thermal transfer with our Skiving Fin Copper Heat Sinks – engineered for applications where aluminum reaches its performance limits. Our precision copper thermal solutions leverage advanced skiving technology to create monolithic fins down to 0.2mm thickness with 30:1 aspect ratios, delivering 60% higher thermal conductivity than aluminum alternatives. Designed for extreme heat flux components in laser systems, EV power modules, and RF amplifiers, these high-density copper coolers eliminate thermal interfaces while maintaining structural integrity at junction temperatures exceeding 200°C.
Product Specification
|
Product name |
copper skived heat sink |
|
Material |
aluminum 6063/Pure Copper |
|
Profile width |
4 foot max profile width |
|
Profile length |
<= 10 in profile length |
|
Gap ratio |
40:1 fin height to minimum gap ratio |
|
Fin height |
<= 50 mm maximum fin height |
|
Fin thickness |
0.2 – 1.0 mm fin thickness |
|
Applications |
Limited space/Forced airflow/Servers/Networking / Telecom boards |
|
Packing |
Carton,EPE,wooden pallet. |
Design Parameters
|
MACHINE |
DIAGONAL |
FIN HEIG |
MACHINE |
DIAGONAL |
FIN HEIG |
 |
|
600T |
<120 mm |
24 |
2750T |
<250 mm |
21 |
|
|
880T |
<130 mm |
24 |
3000T |
<320 mm |
20 |
|
|
1000T |
<150 mm |
22 |
3600T |
<350 mm |
20 |
|
|
1500T |
<180 mm |
22 |
4000T |
<400 mm |
20 |
|
|
1800T |
<200 mm |
21 |
6500T |
<540 mm |
19 |
|
|
2500T |
<230 mm |
21 |
8000T |
<700 mm |
16 |
Features
Fine workmanship: The heat sink is one-time molding without any burr.The air and heat can pass the fin gap unobstructedly;
Custom size:Small size for better performance;
Pure copper base:Solid materials, uniform heat conduction, fast heat transfer, stable and lasting efficiency;
Fine skived fin technology: Uniform fin gap,Fine workmanship without defects.
Products Application
Our high-conductivity skived solutions excel in extreme thermal environments:
Laser Diode Arrays (Fiber, CO₂, Diode-Pumped)
EV Traction Inverters (SiC/GaN Power Modules)
RF Power Amplifiers (5G mMIMO, Radar Systems)
Medical X-Ray Generators
Semiconductor Test Handlers
Aerospace Avionics Cooling
High-Performance Computing (GPU/CPU)
Industrial IGBT Stacks
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